***** To join INSNA, visit http://www.insna.org ***** [Apologies for multiple copies] **************************** CALL FOR PAPERS **************************** 4th IEEE International Conference on Smart Computing (SMARTCOMP 2018) June 18-20, 2018 Taormina, Sicily, Italy https://urldefense.proofpoint.com/v2/url?u=http-3A__smart-2Dcomp.org&d=DwIDaQ&c=pZJPUDQ3SB9JplYbifm4nt2lEVG5pWx2KikqINpWlZM&r=uXI5O6HThk1ULkPyaT6h2Ws3RKNKSY__GQ4DuS9UHhs&m=IA7eJ83JidbHkQfr4lXL22TilDPwYCFC_SXjSzO-ymc&s=zbdXdWUvhm20C5pDBQDOVdz9jECRoe0vtY_u5cwwnNg&e= ************************************************************************* SMARTCOMP is the premier conference on smart computing. Smart computing is based on the synergistic combination of advances in sensing devices, the Internet of Things (IoT), big data, machine learning, cognitive computing, and artificial intelligence. Smart computing is a multidisciplinary domain. Applications of smart computing can be found in different societal domains including, but not limited to, transportation, energy, environmental protection, smart and connected communities, healthcare, banking, entertainment, and social media. Algorithmic and system advancements of cloud computing, mobile/pervasive computing, cyber-physical systems, sensor networking and social computing are taking smart computing to a new dimension and improving our ways of living. SMARTCOMP 2018 invites high-quality papers on original research in advanced algorithms, systems and platforms, and technologies for smart computing. Under the theme of "Smart Living through Computing", SMARTCOMP 2018 will be a forum for the presentation and exchange of cutting-edge ideas. The conference will also feature forums and a panel with distinguished scholars and industrial experts. SMARTCOMP 2018 is soliciting contributions which present smart computing innovations in all different technology aspects including pervasive/ubiquitous computing, cloud computing, sensor networks, the Internet of Things, big data analytics, security and privacy, social computing, cognitive computing, and cyber-physical systems. A special emphasis lies on the validation of such systems within smart computing environments. Moreover, applications of smart computing systems are welcome, such as smart buildings, smart cities, smart grids, precision agriculture, and other societal applications contributing to smart living. # TOPICS OF INTEREST SMARTCOMP 2018 solicits submissions that address the fundamental questions of smart computing, namely how to design and build smart computing systems and how to use computing technology for resource sustainability to improve the human experience. Submissions should thus match to at least one of the following three major fields of interest: 1. SMART COMPUTING CONCEPTS, MODELS AND ALGORITHMS * Future Smart Computing Paradigms * Models of Smart Environments * Algorithms for Smart Computing 2. SMART COMPUTING SYSTEMS * Security, Privacy, and Economics in Smart Environments * Cyber-physical System Platforms for Smart Environments * Middleware Platforms for Smart Environments * Mobile and Ubiquitous Platforms for Smart Environments 3. SMART COMPUTING TECHNOLOGIES AND APPLICATIONS * Smart Precision Agriculture * Smart Transportation * Smart FinTech * Smart Food-Energy-Water Nexus * Smart Health * Smart Communities * Smart Human Environments, Entertainment, and Social Activities * Smart Energy Management and Analytics # SUBMISSION GUIDELINES Paper submissions must be no longer than 8 pages and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at <https://urldefense.proofpoint.com/v2/url?u=http-3A__www.ieee.org_conferences-5Fevents_conferences_publishing_templates.html&d=DwIDaQ&c=pZJPUDQ3SB9JplYbifm4nt2lEVG5pWx2KikqINpWlZM&r=uXI5O6HThk1ULkPyaT6h2Ws3RKNKSY__GQ4DuS9UHhs&m=IA7eJ83JidbHkQfr4lXL22TilDPwYCFC_SXjSzO-ymc&s=4k7_dE-iWwjCNtvzZjiBGlop01l0Xmzp0C0BVpiE5cs&e= >. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class. Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that). Prior to submission, ensure that any running headers/footers, page numbering, as well as blue underlining for URLs and email addresses has been removed. All submitted papers will be subject to peer reviews by Technical Program Committee members and other experts in the field. All presented papers will be published in the conference proceedings and submitted to the IEEE Xplore Digital Library. Authors of selected high-quality papers will be invited to submit substantially extended versions for a possible fast-track publication in the Elsevier Journal on Pervasive and Mobile Computing (PMC). # IMPORTANT DATES Paper registration: January 17, 2018 Paper submission: January 24, 2018 Acceptance notification: March 29, 2018 Camera-ready version: April 21, 2018 # ORGANIZING COMMITTEES GENERAL CO-CHAIRS Giuseppe Anastasi (University of Pisa, Italy) Nalini Venkatasubramanian (University of California at Irvine, USA) TECHNICAL PROGRAM CO-CHAIRS Andreas Reinhardt (TU Clausthal, Germany) Antonio Puliafito (University of Messina, Italy) WORKSHOPS CHAIR Dario Bruneo (University of Messina, Italy) KEYNOTE CO-CHAIRS Sajal Das (Missouri University of Science & Technology, USA) Jiannong Cao (Hong Kong Polytechnic University, Hong Kong) WIP AND DEMO CHAIR Marco Ortolani (University of Palermo, Italy) PHD FORUM CHAIR Mario Di Francesco (Aalto University, Finland) PUBLICATION CHAIR Francesco Longo (University of Messina, Italy) REGISTRATION AND FINANCE CHAIR Carmen Au (Hong Kong Polytechnic University, Hong Kong) Maciej Zawodniok (Missouri University of Science and Technology, USA) PUBLICITY CO-CHAIRS Marco Tiloca (RISE SICS, Sweden) Weigang Wu (Sun Yat-sen University, China) Marco Levorato (University of California at Irvine, USA) LOCAL ARRANGEMENTS CHAIR Rossana Morana (University of Messina, Italy) WEB CHAIR Francesca Righetti (University of Pisa, Italy) STEERING COMMITTEE Jiannong Cao (Hong Kong Polytechnic University, Hong Kong) Sajal K. Das (Missouri University of Science and Technology, USA) Giuseppe Anastasi (University of Pisa, Italy) Vijayakumar Bhagavatula (Carnegie Mellon University, USA) Victor Leung (The University of British Columbia, Canada) Neeraj Suri (Technische Universität Darmstadt, Germany) Albert Zomaya (The University of Sydney, Australia) TECHNICAL PROGRAM COMMITTEE Tarek Abdelzaher, University of Illinois at Urbana-Champaign, United States Carmen Au, PolyU, Hong Kong Christian Becker, University of Mannheim, Germany Paolo Bellavista, University of Bologna, Italy Dario Bruneo, University of Messina, Italy Sriram Chellappan, University of South Florida, United States Sinem Coleri Ergen, Koc University, Turkey Debraj De, Missouri University of Science & Technology, United States Alessandra De Paola, University of Palermo, Italy Mario Di Francesco, Aalto University, Finland Gianluca Dini, University of Pisa, Italy Salvatore Distefano, University of Messina, Italy Anna Förster, University of Bremen, Germany Mohammad Hajiesmaili, The Chinese University of Hong Kong, Hong Kong Qi Han, Colorado School of Mines, United States Hai Jin, Huazhong University of Science and Technology, China Salil Kanhere, The University of New South Wales, Australia Fanxin Kong, University of Pennsylvania, United States Chi Harold Liu, Beijing Institute of Technology, China Francesco Longo, University of Messina, Italy Muthucumaru Maheswaran, McGill University, Canada Francesco Marcelloni, University of Pisa, Italy Giovanni Merlino, University of Messina, Italy Marco Morana, University of Palermo, Italy Kyung-Joon Park, DGIST, South Korea Andrea Passarella, IIT-CNR, Italy Dirk Pesch, Cork Institute of Technology, Ireland Omer Rana, Cardiff University, United Kingdom Nirmalya Roy, University of Maryland Baltimore County, United States Simone Silvestri, University of Kentucky, United States Neeraj Suri, TU Darmstadt, Germany Athena Vakali, Aristotle University of Thessaloniki, Greece Carlo Vallati, University of Pisa, Italy O.P. Vyas, Pt. Ravishankar Shukla University Raipur, India -- Marco Tiloca, PhD Research Institutes of Sweden RISE ICT/SICS Isafjordsgatan 22 / Kistagången 16 SE-164 40 Kista (Sweden) Phone: +46 (0)70 60 46 501 https://urldefense.proofpoint.com/v2/url?u=https-3A__www.sics.se&d=DwIDaQ&c=pZJPUDQ3SB9JplYbifm4nt2lEVG5pWx2KikqINpWlZM&r=uXI5O6HThk1ULkPyaT6h2Ws3RKNKSY__GQ4DuS9UHhs&m=IA7eJ83JidbHkQfr4lXL22TilDPwYCFC_SXjSzO-ymc&s=20ITrzX6IflxzFehjKJ5551MT8Lz6WLcZsomiHSMajc&e= https://urldefense.proofpoint.com/v2/url?u=https-3A__www.sics.se_-7Emarco_&d=DwIDaQ&c=pZJPUDQ3SB9JplYbifm4nt2lEVG5pWx2KikqINpWlZM&r=uXI5O6HThk1ULkPyaT6h2Ws3RKNKSY__GQ4DuS9UHhs&m=IA7eJ83JidbHkQfr4lXL22TilDPwYCFC_SXjSzO-ymc&s=taicalOgXsta0N_Ls6qB66PLdzaXbvi2NDg3nOL3i2w&e= The RISE institutes Innventia, SP and Swedish ICT have merged in order to become a stronger research and innovation partner for businesses and society. SICS Swedish ICT AB, has now changed name to RISE SICS AB. _____________________________________________________________________ SOCNET is a service of INSNA, the professional association for social network researchers (http://www.insna.org). To unsubscribe, send an email message to [log in to unmask] containing the line UNSUBSCRIBE SOCNET in the body of the message.